Heterogeneous device
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United States of America Patent
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Sep 15, 2020
Grant Date -
Oct 19, 2017
app pub date -
Jun 30, 2017
filing date -
Aug 30, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.
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