PLASMA SOURCE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Oct 19, 2017
app pub date -
Jul 25, 2016
filing date -
Apr 19, 2016
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Abstract
An apparatus for treating a substrate includes a process chamber with a treatment space, a substrate support unit that supports the substrate, a gas supply unit that supplies a gas into the treatment space, and a plasma source that excites the gas into plasma, the process chamber includes a discharge chamber that is provided over the substrate support unit and has a space in which the gas is excited into the plasma, and the plasma source includes an antenna including a first coil and a second coil that surround a side surface of the discharge chamber along a circumference of the discharge chamber, and a power supply that applies electric power to the antenna, wherein the first coil and the second coil are alternately arranged along a vertical direction, and when viewed from the top, currents flow through the first coil and the second coil in the same direction.
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