Soundboard apparatus and method of forming
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United States of America Patent
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Feb 12, 2019
Grant Date -
Oct 19, 2017
app pub date -
Mar 27, 2015
filing date -
Jun 30, 2014
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Abstract
The present invention concerns soundboard apparatus for a musical instrument, the apparatus comprising a soundboard substrate formed of composite fibrous resin bonded material having a thickness of between 0.75 mm and 3 mm; and an outer layer formed of ultra-violet light blocking material having a thickness of between 0.5 and 0.9 mm. Further, the present invention relates to a method of forming a soundboard apparatus, the method comprising the steps of: bonding multiple layers of woven or straight stranded fibrous material in a resinous matrix to form a soundboard substrate, wherein the soundboard substrate is formed such that it is oversized with respect to final soundboard substrate dimensions; and finishing the soundboard substrate to form the final substrate, the finishing process being constrained to ensure that the final substrate dimensions are not compromised.
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