Method of manufacturing glass sheet
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United States of America Patent
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Aug 11, 2020
Grant Date -
Oct 19, 2017
app pub date -
Jul 5, 2017
filing date -
Jan 5, 2015
priority date (Note) -
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Abstract
A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.
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