METHODS AND SYSTEMS FOR MOLD RELEASES
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United States of America Patent
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Issued Date -
Oct 19, 2017
app pub date -
Jun 29, 2017
filing date -
Jan 5, 2015
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Abstract
Molding optical components with fine (e.g., micron-scale) features from optical adhesive or polymer can be difficult because the optical components often stick to the mold. If the component sticks to the mold, then either the component or the mold may be damaged or destroyed as the component is removed from the mold. This damage can be reduced or avoided altogether by illuminating the interface between the component and the mold with ultraviolet (UV) light before releasing the component from the mold. The UV light reduces the adhesive forces that cause the component and the mold to stick together, making it easier to remove the component from mold without damaging either the mold or the component.
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