INTEGRATED ELECTRONIC PAPER
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United States of America Patent
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Apr 6, 2017
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Apr 7, 2016
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Abstract
The present invention is directed to an integrated electronic substrate a substrate, a radio frequency identification device embedded in the substrate; a metallic deposition disposed on the substrate; the metallic deposition is in electronic communication with the radio frequency identification device to enhance the effective range and power of the radio frequency identification device.
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