SURFACTANT-CONTAINING AMIDE COMPOUND SOLUTION

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United States of America Patent

SERIAL NO

15508350

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Abstract

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The present invention relates to an amide compound solution comprising an amide compound and a surfactant. More specifically, the invention relates to an amide compound solution comprising amide compound, and 2.7˜20 mg of a cationic surfactant per 1 kg of the amide compound or 0.01˜10 mg of a C15˜C20 carboxylic acid or its salt as an anionic surfactant per 1 kg of the amide compound. The present invention provides an amide compound solution which is manufactured using a biocatalyst and which has a low level of foaming, and thereby improving the operability and yield when manufacturing an amide compound-based polymer.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008251 ?1008251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAGIYA, Norifumi Tokyo, JP 6 4
KANO, Makoto Tokyo, JP 108 1093

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