PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Oct 5, 2017
app pub date -
Feb 21, 2017
filing date -
Mar 31, 2016
priority date (Note) -
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Abstract
A printed circuit board has a copper clad laminate and a plurality of holes. The copper clad laminate for dissipating heats generated from a chip when the chip operates has a plurality of solder paste disposed areas. The plurality of holes situate on the copper clad laminate and each of the holes does not communicate with others, wherein the plurality of holes are nonconductors. Each of the solder paste disposed areas is surrounded by the plurality of holes and each solder paste disposed areas is surrounded by at least two holes.
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