PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Oct 5, 2017
app pub date -
Jul 31, 2015
filing date -
Sep 19, 2014
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Abstract
A lead-out wiring, which is connected to a comb-shaped electrode formed on a principal surface of a piezoelectric substrate and is disposed to extend to an outer edge of the piezoelectric substrate an outer surrounding wall layer, which is arranged surrounding an outer periphery of the piezoelectric substrate including the lead-out wiring and forms a hollow portion that serves as an operation space for the comb-shaped electrode, and a top board, which bridges the outer surrounding wall layer to seal the hollow portion, are included.
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