Cu column, Cu core column, solder joint, and through-silicon via
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 20, 2020
Grant Date -
Oct 5, 2017
app pub date -
Sep 9, 2014
filing date -
Sep 9, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.
First Claim
Family
International Classification(s)
- C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- C22C:ALLOYS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully