Method of manufacturing semiconductor device
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United States of America Patent
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Apr 14, 2020
Grant Date -
Oct 5, 2017
app pub date -
Jun 15, 2017
filing date -
Dec 16, 2014
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device, includes rotating a substrate support tool accommodated in a process chamber and configured to support a substrate with a rail, and supplying a process gas including a first gas to the substrate from a first gas supply hole positioned at an outer side of the substrate in a horizontal direction while rotating the substrate support tool. In the act of supplying the process gas, the first gas is supplied to the substrate in a first period in which the rail is not positioned between the first gas supply hole and the substrate in the horizontal direction.
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