Electroconductive Resin Composite and Electroconductive Resin Composition Having Excellent Impact Strength, and Method of Producing the Same

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United States of America Patent

SERIAL NO

15471674

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Abstract

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An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

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Patent Owner(s)

Patent OwnerAddress
SK INNOVATION CO LTD26 JONG-RO JONGNO-GU SEOUL 03188
SK GLOBAL CHEMICAL CO LTD99 SEORIN-DONG JONGNO-GU SEOUL 110-110

International Classification(s)

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  • 2017 Application Filing Year
  • C08J Class
  • 2565 Applications Filed
  • 1597 Patents Issued To-Date
  • 62.27 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Yun Kyun Daejeon, KR 4 1

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges24941740911101 - 1011 - 2021 - 3041 - 5061 - 70100 +0255075100125150175200225250275300325350375400425450

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