Electroconductive Resin Composite and Electroconductive Resin Composition Having Excellent Impact Strength, and Method of Producing the Same
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United States of America Patent
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app pub date -
Mar 28, 2017
filing date -
Mar 29, 2016
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Abstract
An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SK INNOVATION CO LTD | 26 JONG-RO JONGNO-GU SEOUL 03188 | |
SK GLOBAL CHEMICAL CO LTD | 99 SEORIN-DONG JONGNO-GU SEOUL 110-110 |
International Classification(s)

- 2017 Application Filing Year
- C08J Class
- 2565 Applications Filed
- 1597 Patents Issued To-Date
- 62.27 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Lee, Yun Kyun | Daejeon, KR | 4 | 1 |
# of filed Patents : 4 Total Citations : 1 |
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- 0 Citation Count
- C08J Class
- 0 % this patent is cited more than
- 8 Age
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