FLEXIBLE INTERCONNECTION BETWEEN SUBSTRATES AND A MULTI-DIMENSIONAL LIGHT ENGINE USING THE SAME
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United States of America Patent
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app pub date -
Mar 31, 2016
filing date -
Mar 31, 2016
priority date (Note) -
Abandoned
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Abstract
Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. The multi-dimensional lighting device includes external mounting surfaces, each configured to provide mounting positions for one or more substrates. A flexible jumper device electrically couples a given substrate to an adjacent substrate, and provides a predefined clearance between surfaces of the same and exposed conductive surfaces of the lighting device. Each flexible jumper includes a surface mount device (SMD) capable of being placed by automated process, such as by pick-and-place machines. Such lighting devices are thus possible using automated processes in a high-volume, highly-precise manner.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
OSRAM SYLVANIA INC | 100 ENDICOTT STREET DANVERS MA 01923 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Godina, Jesus | Apodaca, MX | 1 | 5 |
Jeswani, Anil | Acton, US | 74 | 614 |
Li, Ming | Acton, US | 1285 | 14101 |
Morin, Alfredo | San Nicolas, MX | 1 | 5 |
Zolotykh, Valeriy | Abington, US | 52 | 192 |
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