Substrate Processing Apparatus

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United States of America Patent

SERIAL NO

15203460

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes: a process chamber where a substrate is processed; a substrate support, disposed in the process chamber, where the substrate is placed; a transfer chamber disposed under the process chamber; a partition dividing the process and transfer chambers; a first heating unit disposed in the substrate support to heat the substrate and the process chamber; a second heating unit disposed in the transfer chamber to heat the transfer chamber; a process gas supply unit to supply a process gas into the process chamber; a first cleaning gas supply unit to supply a cleaning gas into the process chamber; a second cleaning gas supply unit to supply the cleaning gas into the transfer chamber; and a control unit to control the first heating unit, the second heating unit, the process gas supply unit, the first cleaning gas supply unit and the second cleaning gas supply unit.

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Patent Owner(s)

Patent OwnerAddress
HITACHI KOKUSAI ELECTRIC INC15-12 NISHI-SHIMBASHI 2-CHOME MINATO-KU TOKYO 105-8039

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUI, Shun Toyama, JP 54 94
TAKANO, Satoshi Toyama, JP 153 1980
TOYODA, Kazuyuki Toyama, JP 75 2553
YAHATA, Takashi Toyama, JP 48 419

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