Heat sink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170280591A1
SERIAL NO

15242420

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat sink that radiates heat via the metal shell of the electronic device is provided. The upper portion of the heat sink is formed by a solid aluminium block boss, and the lower portion of the heat sink is formed by an aluminium substrate, wherein at least one fin is configured on either side of the solid aluminium block boss.

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Patent Owner(s)

Patent OwnerAddress
LE SHI ZHI XIN ELECTRONIC TECHNOLOGY (TIANJIN) LIMITED201-427 2ND FLOOR B1 DONGMAN BUILDING NO 126 DONGMAN MIDDLE ROAD ECO-CITY BINHAI NEW AREA TIANJIN 300450
LE HOLDINGS (BEIJING) CO LTDROOM 1102 LAYER 10 BUILDING 3 105 YAOJIAYUAN ROAD CHAO YANG DISTRICT BEIJING 100025

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEI, Lintao Beijing, CN 2 0
MA, Erhu Beijing, CN 2 0
YANG, Guoping Beijing, CN 8 43
ZHANG, Weiqiang Beijing, CN 79 325

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