PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND OLED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

SERIAL NO

15502390

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Abstract

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A package substrate and a manufacturing method thereof, and an OLED display device and a manufacturing method thereof are provided. The package substrate comprises a base substrate (1), the base substrate (1) includes a bonding region (11) for coating an adhesive. The package substrate further comprises a first barrier wall (2) located on the base substrate (1), and the first barrier wall (2) is arranged along an outer side edge of the bonding region (11).

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTDBEIJING 100015
ORDOS YUANSHENG OPTOELECTRONICS CO LTDORDOS EQUIPMENT MANUFACTURING BASE DONGSHENG DISTRICT ORDOS INNER MONGOLIA 017020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AO, Ning Beijing, CN 6 9
CHUO, Luopeng Beijing, CN 2 9
MIN, Chonkyu Beijing, CN 4 7
XU, Jin Beijing, CN 309 1854

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