Solder inspection apparatus and method of generating feedback information of solder inspection apparatus
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United States of America Patent
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Aug 18, 2020
Grant Date -
Sep 28, 2017
app pub date -
Aug 17, 2015
filing date -
Aug 18, 2014
priority date (Note) -
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Abstract
A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.
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