WIRING STRUCTURE AND IMAGE FORMING APPARATUS

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United States of America Patent

APP PUB NO 20170277107A1
SERIAL NO

15258801

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to an aspect of the invention, a wiring structure includes a pair of printed circuit boards, a cable that connects the pair of printed circuit boards, and a grounding member that causes grounding of the cable in a region including a position separated from a connection end between the printed circuit board and the cable by a distance obtained by dividing a radiation mode length of a system including the cable and the pair of printed circuit boards as antennas by 2.

First Claim

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Patent Owner(s)

Patent OwnerAddress
FUJI XEROX CO LTDTOKYO

International Classification(s)

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  • 2016 Application Filing Year
  • B41J Class
  • 2975 Applications Filed
  • 2517 Patents Issued To-Date
  • 84.61 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HORIGUCHI, Takahiro Yokohama-shi, JP 27 1323
OKADO, Makoto Yokohama-shi, JP 6 25
SHISEKI, Fumiya Yokohama-shi, JP 2 22

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Patent Citation Ranking

  • 0 Citation Count
  • B41J Class
  • 0 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges515165217047168321301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80100 +0100200300400500600700800900100011001200130014001500160017001800

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