Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component
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Sep 4, 2015
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Sep 4, 2014
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Provided is a lead-free solder alloy for terminal preliminary plating, by which the separation property when pulling up the terminals from molten solder is improved. The lead-free solder alloy for terminal preliminary plating contains 4 mass % or more and 6 mass % or less of Cu, 0.1 mass % or more and 0.2 mass % or less of Ni, 0.01 mass % or more and 0.04 mass % or less of Ga, 0.004 mass % or more and 0.03 mass % or less of P, and a remainder of Sn, a total amount of Ga and P being 0.05 mass % or less. Its tension in a melted condition by heating in soldering temperature is 200 dyn/cm or less.
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