SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET EACH OF WHICH USES SAME
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United States of America Patent
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app pub date -
Mar 26, 2015
filing date -
Aug 26, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a dendritic silver-coated copper powder which is capable of effectively ensuring a contact, while having excellent electrical conductivity by having the surface coated with silver. A silver-coated copper powder according to the present invention is obtained by coating the surface of a copper powder 1, which is an assembly of copper particles 2 and has a dendritic form having a plurality of branches, with silver. Each copper particle 2, the surface of which is coated with silver, is an ellipsoid that has a breadth within the range of from 0.2 μm to 0.5 μm and a length within the range of from 0.5 μm to 2.0 μm. The average particle diameter (D50) of the copper powder 1, which is obtained by coating the surface of the assembly of the ellipsoidal copper particles 2 with silver, is from 5.0 μm to 20 μm.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- C25C:PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVER....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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