MULTI-PLANE MICROARRAYS
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United States of America Patent
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Issued Date -
Sep 28, 2017
app pub date -
Mar 28, 2017
filing date -
Mar 28, 2016
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Abstract
An array including a solid support having a plurality of contours along its exterior surface. A first subset of contours is positioned along the exterior surface of the solid support to form a first pattern of features and a second subset of contours is positioned along the exterior surface to form a second pattern of features. The contours of the first subset are juxtaposed with the second subset along the exterior surface, whereby the first and second patterns form an interleaved pattern. The features of the first pattern occur at a first elevation z1 and the features of the second pattern occur at a second elevation z2. The features of the first pattern are configured to attach analytes at a different elevation relative to analytes attached to the features of the second pattern.
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