Inspection apparatus and method, and system and method for mounting components including the same
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United States of America Patent
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Nov 3, 2020
Grant Date -
Sep 21, 2017
app pub date -
Aug 10, 2015
filing date -
Aug 11, 2014
priority date (Note) -
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Abstract
The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.
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