EMBEDDED CAVITY IN PRINTED CIRCUIT BOARD BY SOLDER MASK DAM

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United States of America

APP PUB NO 20170271734A1
SERIAL NO

15087793

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Abstract

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A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes an embedded cavity, the perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask dam. The solder mask dam defines cavity dimensions and prevents prepreg resin flow into the cavity during lamination.

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Patent Owner(s)

Patent OwnerAddress
MULTEK TECHNOLOGIES LIMITED6201 AMERICA CENTER DRIVE SAN JOSE CA 95002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jiawen Guangdong, CN 35 675
Yu, Pui Yin Tsuen Wan, HK 15 53

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