MINIATURIZED ELECTRONIC COMPONENT WITH REDUCED RISK OF BREAKAGE AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Jun 1, 2017
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Dec 1, 2014
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Abstract
A method for producing miniaturized electronic components is provided, where the miniaturized electronic components are obtained as singularized parts of a sheet-like glass which has structures applied thereon, in particular at least one layer. The method includes the steps of: providing a sheet-like glass toughened at least during a time period, as a substrate material; applying structures onto the substrate, in particular in the form of a sequence of coating processes and by processes for patterning of layers, so that at least portions of the substrate carry structures while other portions of the substrate remain free; subjecting the substrate carrying the structures to a thermal load; and singularizing so that the portions of the substrate carrying structures are obtained in singularized form. A miniaturized electronic component produced in this manner is also provided.
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