Method of producing semiconductor chips that efficiently dissipate heat
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United States of America Patent
Stats
-
Mar 5, 2019
Grant Date -
Sep 21, 2017
app pub date -
Jun 6, 2017
filing date -
Feb 16, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 6 Age
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