SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20170271294A1
SERIAL NO

15460023

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Abstract

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Methods and compositions are described for controlling bond line thickness of a joint formed during sintering. Spacer particles of a predetermined particle type and size are added in a predetermined concentration to a sintering paste to form a sintering paste mixture prior to sintering to achieve a targeted bond line thickness during sintering. The sintering paste mixture can be sintered under pressure and pressure-less process conditions. Under pressured sintering, the amount of pressure applied during sintering may be adjusted depending on the composition and concentration of the spacer particles to adjust bond line thickness.

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Patent Owner(s)

Patent OwnerAddress
INDIUM CORPORATION34 ROBINSON ROAD CLINTON NY 20876

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Sihai New Hartford, US 6 23
Lee, Ning-Cheng New Hartford, US 46 254

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