LEAD FRAME WITH SOLDER SIDEWALLS
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United States of America Patent
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app pub date -
Mar 21, 2016
filing date -
Mar 21, 2016
priority date (Note) -
Abandoned
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Abstract
A leadframe wherein the outer sidewalls of the leadframe that are exposed by sawing during singulation are comprised of greater than 50% solder. A leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised of greater than 50% solder. A method of forming a leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised primarily of solder. A method of forming a leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised entirely of solder.
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