METHOD FOR FORMING METALLIZATION STRUCTURE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20170271173A1
SERIAL NO

15259504

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a second portion of the metallic powder layer to form a metal oxide layer to serve as a first dielectric layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPNO 8 KEYA 1ST RD DAYA DISTRICT CENTRAL TAIWAN SCIENCE PARK TAICHUNG CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HO, Yu-Hsuan Taoyuan City, TW 34 41

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation