Thermal Bonding of Multi-Layer Glass Capacitors

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United States of America Patent

SERIAL NO

15448250

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Abstract

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High energy density multi-layer capacitors comprise inner electrodes buried within thin layers of alkali-free glass. The multi-layer glass capacitor can be fabricated by heating a plurality of capacitor layers above the annealing temperature of the glass to thermal bond the layers together. The edge margin of the buried electrodes can be selected to provide an adequate protection level from high-voltage flashover of the multi-layer glass capacitor. For example, an edge margin of 0.125″ can hold off about 10 kV in air.

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SANDIA CORPORATIONALBUQUERQUE NM

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  • 2017 Application Filing Year
  • C03B Class
  • 569 Applications Filed
  • 369 Patents Issued To-Date
  • 64.86 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown-Shaklee, Harlan James Albuquerque, US 12 12
Wilke, Rudeger HT Albuquerque, US 2 4

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  • 1 Citation Count
  • C03B Class
  • 37.76 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1652647101 - 1011 - 2021 - 30020406080100120140160180200220240260280

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