Thermal Bonding of Multi-Layer Glass Capacitors
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United States of America Patent
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Issued Date -
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app pub date -
Mar 2, 2017
filing date -
Mar 15, 2016
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Abstract
High energy density multi-layer capacitors comprise inner electrodes buried within thin layers of alkali-free glass. The multi-layer glass capacitor can be fabricated by heating a plurality of capacitor layers above the annealing temperature of the glass to thermal bond the layers together. The edge margin of the buried electrodes can be selected to provide an adequate protection level from high-voltage flashover of the multi-layer glass capacitor. For example, an edge margin of 0.125″ can hold off about 10 kV in air.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SANDIA CORPORATION | ALBUQUERQUE NM |
International Classification(s)

- 2017 Application Filing Year
- C03B Class
- 569 Applications Filed
- 369 Patents Issued To-Date
- 64.86 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Brown-Shaklee, Harlan James | Albuquerque, US | 12 | 12 |
# of filed Patents : 12 Total Citations : 12 | |||
Wilke, Rudeger HT | Albuquerque, US | 2 | 4 |
# of filed Patents : 2 Total Citations : 4 |
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Patent Citation Ranking
- 1 Citation Count
- C03B Class
- 37.76 % this patent is cited more than
- 8 Age
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