Soy-modified resins for bonding wood
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United States of America Patent
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Jan 26, 2021
Grant Date -
Sep 21, 2017
app pub date -
Mar 16, 2017
filing date -
Mar 16, 2016
priority date (Note) -
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Abstract
Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
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