Soy-modified resins for bonding wood
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United States of America Patent
Stats
-
Jan 26, 2021
Grant Date -
Sep 21, 2017
app pub date -
Mar 16, 2017
filing date -
Mar 16, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
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International Classification(s)
- 2017 Application Filing Year
- C09J Class
- 1394 Applications Filed
- 852 Patents Issued To-Date
- 61.12 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09J Class
- 0 % this patent is cited more than
- 4 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
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