Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
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United States of America Patent
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Aug 18, 2020
Grant Date -
Sep 14, 2017
app pub date -
Mar 20, 2016
filing date -
Mar 12, 2016
priority date (Note) -
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Abstract
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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