INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUCTIVE SHIELD LAYER AND ASSOCIATED METHODS
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United States of America Patent
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Mar 14, 2016
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Mar 14, 2016
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Abstract
An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an outer surface of the encapsulated body. An electrically conductive shield layer is on the outer surface of the encapsulated body and in contact with the exposed distal end of the at least one grounding wire.
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