Mitigation of whisker growth in tin coatings by alloying with indium

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United States of America Patent

PATENT NO 10879156
APP PUB NO 20170263541A1
SERIAL NO

15169194

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Abstract

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A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate. The indium is present in the entire thickness of the Sn film.

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Patent Owner(s)

Patent OwnerAddress
WASHINGTON STATE UNIVERSITYLIGHTY 280/286 PO BOX 641060 PULLMAN WA 99164-1060

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dutta, Indranath Pullman, US 6 27

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