Stacked chip-on-board module with edge connector
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United States of America Patent
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Apr 14, 2020
Grant Date -
Sep 14, 2017
app pub date -
May 26, 2017
filing date -
Apr 21, 2011
priority date (Note) -
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Abstract
A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.
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