All solution-process and product for transparent conducting film
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United States of America Patent
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Jun 2, 2020
Grant Date -
Sep 14, 2017
app pub date -
Mar 10, 2017
filing date -
Mar 11, 2016
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Abstract
An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.
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