RESIN COMPOSITION

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United States of America Patent

SERIAL NO

15604016

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Abstract

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Provided are a resin composition controlled such that after keeping under a severe environment as in high temperature hot water or in hot water under chemically severe condition, such as an acidic or basic condition, etc., for a fixed period of time, it is quickly decomposed; and a structure thereof.

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Patent Owner(s)

Patent OwnerAddress
TEIJIN LIMITEDOSAKA CITY OSAKA OF JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWAI, Masahiro Yamaguchi, JP 7 47
KANEMATSU, Shunsuke Yamaguchi, JP 10 63
ONO, Yuhei Yamaguchi, JP 19 304
SHOJI, Shinichiro Yamaguchi, JP 24 153

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