Method for processing film
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United States of America Patent
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Feb 2, 2021
Grant Date -
Sep 14, 2017
app pub date -
Aug 5, 2015
filing date -
Sep 9, 2014
priority date (Note) -
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Abstract
Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B′) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.
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