OPTICAL ELECTRONIC DEVICE AND METHOD OF FABRICATION
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United States of America Patent
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app pub date -
Aug 17, 2016
filing date -
Mar 2, 2016
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Abstract
Electronic devices are collectively fabricated from a main wafer which includes optical elements and a secondary wafer that are mounted one on top of the other to form a combined wafer. A mounting face of the secondary wafer is mated to a front face of the main wafer in such a manner that recesses within the mounting face of the secondary wafer are aligned over the optical elements. The thickness of the secondary wafer reduced until the recesses are opened to form ring structures with openings at the recesses. The combined wafer is diced to form electronic devices. A base wafer of the main wafer and the secondary wafer are made of a same semiconductor material (for example, silicon).
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