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United States of America Patent
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Jan 2, 2018
Issued Date -
N/A
app pub date -
May 22, 2017
filing date -
Jun 24, 2014
priority date (Note) -
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Abstract
A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.
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