WAFER HANDLING ASSEMBLY
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United States of America Patent
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Issued Date -
Sep 7, 2017
app pub date -
Dec 13, 2016
filing date -
Mar 1, 2016
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Abstract
A wafer handling assembly comprising a center hub supporting a vertical non-contact lifting head and at least one radially extending and radially retracting wafer engaging mechanism having a surface to engage a wafer at a peripheral edge of the wafer, where the peripheral edge is a corner edge or a side edge. In some implementations, the wafer engaging mechanism has a foot on which the wafer edge is supported. The lifting head may be vertically moveable in respect to the assembly.
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