EMISSIVITY, SURFACE FINISH AND POROSITY CONTROL OF SEMICONDUCTOR REACTOR COMPONENTS

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United States of America Patent

APP PUB NO 20170256401A1
SERIAL NO

15596117

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus and methods are provided related to a surface of a reaction chamber assembly component. The surface may be roughened and/or anodized to provide desirable emissivity and porosity to help reduce burn-in time of a reaction chamber and to help reduce particles within the chamber. The apparatus and methods may be suitable for thin film deposition on semiconductor or other substrates.

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Patent Owner(s)

Patent OwnerAddress
ASM IP HOLDING B VVERSTERKERSTRAAT 8 ALMERE 1322 AP

International Classification(s)

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  • 2017 Application Filing Year
  • C23C Class
  • 3339 Applications Filed
  • 2148 Patents Issued To-Date
  • 64.34 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shugrue, John Kevin Phoenix, US 20 2767
White, Carl Louis Phoenix, US 36 4417

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4219241045322915232201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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