HEAT PIPE MODULE AND HEAT DISSIPATING DEVICE USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170254600A1
SERIAL NO

15383169

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

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Patent Owner(s)

Patent OwnerAddress
COOLER MASTER CO LTDTAIPEI CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIN, Te-Hsuan New Taipei City, TW 15 105
SUN, Chien-Hung New Taipei City, TW 73 526

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