HALOGEN-FREE AND FLAME RETARDANT COMPOSITIONS WITH LOW THERMAL EXPANSION FOR HIGH DENSITY PRINTED WIRING BOARDS
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Aug 25, 2015
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Aug 29, 2014
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Abstract
A multifunctional naphthol-based epoxy resin composition which is a reaction product of a) a naphthol which is a reaction product of i) from 1 to 99 weight percent 1-naphthol and ii) from 1 to 99 weight percent 2-naphthol; and b) an epihalohydrin, is disclosed. Also disclosed is a curable composition comprising: a) an epoxy component comprising the multifunctional naphthol-based epoxy resin composition; and b) a hardener component comprising i) a phenolic resin component selected from the group consisting of phenol novolac resins, triphenolalkane phenolic resins, aralkyl phenolic resins, biphenyl phenolic resin, biphenyl aralkyl phenolic resins, substituted naphthalene phenolic resins unsubstituted naphthalene phenolic resins, and combinations thereof; and ii) a phosphorus-containing composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). The curable composition can be used to prepare prepregs, electrical laminates, printed circuit boards, and printed wiring boards.
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