METALLIC COPPER PARTICLES, AND PRODUCTION METHOD THEREFOR
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United States of America Patent
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Aug 26, 2015
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Aug 28, 2014
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Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300° C.; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and/or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass % of gelatin and/or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100° C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300° C. under a nitrogen atmosphere of 1×10-2 Ω·cm or less.
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