Correction die for wafer/die stack

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United States of America Patent

PATENT NO 10636767
APP PUB NO 20170250161A1
SERIAL NO

15057083

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Importance

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Abstract

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Representative implementations of devices and techniques provide correction for a defective die in a wafer-to-wafer stack or a die stack. A correction die is coupled to a die of the stack with the defective die. The correction die electrically replaces the defective die. Optionally, a dummy die can be coupled to other die stacks of a wafer-to-wafer stack to adjust a height of the stacks.

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Patent Owner(s)

Patent OwnerAddress
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC3025 ORCHARD PARKWAY SAN JOSE CA 95134

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haba, Belgacem Saratoga, US 769 23924

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