SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 31, 2017
app pub date -
Aug 31, 2016
filing date -
Feb 25, 2016
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to one embodiment, there is provided a semiconductor device including a first wiring, a semiconductor chip, a first bonding member, having a first melting temperature, located between the first wiring and the semiconductor chip, and a second wiring including a first connection unit and a second connection unit spaced from the first connection unit. A second bonding member having a second melting temperature higher than the first melting temperature is located between the semiconductor chip and the first connection unit. A third wiring is also provided, and a third bonding member having a third melting temperature lower than the second melting temperature is located between the second connection unit and the third wiring.
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