Method and Apparatus for Cooling Integrated Circuits
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United States of America Patent
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Issued Date -
Aug 31, 2017
app pub date -
Feb 29, 2016
filing date -
Feb 29, 2016
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Abstract
An apparatus having first, second, and third chambers and a plurality of receiving channels is disclosed. The first chamber includes a device surface to be cooled. The second chamber has a first surface positioned opposite to the device surface to be cooled, the first surface including a plurality of jet openings adapted to spray a coolant on the device surface when the second chamber is pressured with the coolant. The third chamber is adapted to receive coolant that left the first chamber. Each of the receiving channels has a first end in the first chamber and a second end in the third chamber. Each of the receiving channels is adjacent to a corresponding one of the jet openings and is positioned to remove coolant dispersed into the first chamber by that jet opening.
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