MULTI-LAYER COMPOSITE BACKPLATE FOR MICROMECHANICAL MICROPHONE
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May 8, 2017
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May 28, 2013
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Backplates for MEMS devices. In one embodiment, the backplate includes an interconnect layer, a first layer, a second layer and a plurality of openings. The interconnect layer includes a first side and a second side that is opposite from the first side. The first layer is coupled to the first side of the interconnect layer. The second layer is coupled to the second side of the interconnect layer. The plurality of openings are located between a first side of the backplate and a second side of the backplate.
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