Camera Module Based on Molding Technique and Molded Circuit Unit and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Aug 24, 2017
app pub date -
Mar 1, 2016
filing date -
Feb 18, 2016
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Abstract
Molded circuit unit of camera module, based on molding technique, and manufacturing method thereof, includes a circuit board portion and a molding portion. The circuit board portion is electrically connected with a sensor of the camera module. The molding portion is molded to form on the circuit board portion to enclose electric elements protruded on the circuit board portion and support the camera lens of the camera module.
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