SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR RADIAL FEATURE

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United States of America Patent

SERIAL NO

15422978

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

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Patent Owner(s)

Patent OwnerAddress
MERCURY SYSTEMS INC201 RIVERNECK ROAD CHELMSFORD MA 01824

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MCKENNEY, Darryl J Londonderry, US 20 355
METHRATTA, Absu Waltham, US 4 32
OUELLETTE, Erica Boxboro, US 3 29

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